As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders ...

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system ...

Changing its Blackwell architectural plan, Nvidia ( NVDA, Financials) is reordering its product line and supply chain focus.

Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a ...

Nvidia's demand for advanced packaging from Taiwan Semiconductor remains strong despite evolving technology; plans to use ...

TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate ...

Nvidia's ( NASDAQ: NVDA) latest Blackwell lineup suggests it will reduce demand for CoWoS-S from Taiwan Semiconductor Manufacturing Company ( NYSE: TSM) for at least the next year based on design ...

Shares of Nvidia Corp. (NVDA) rose by more than 1% in pre-market trade on Thursday after CEO Jensen Huang brushed aside ...

Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming ...

TSMC (TSM.US)’s CoWoS is rumored to have faced order cuts and slackened production expansion, according to multiple media ...

Jensen Huang, CEO of Nvidia, who visited Taiwan, stated that the demand for advanced packaging (CoWoS) from TSMC is rapidly ...